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1 composite mask
багатошарова маскаEnglish-Ukrainian dictionary of microelectronics > composite mask
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2 mask
1. ім.1) фотошаблон; шаблон; (вільна) маска; трафарет2) маска, маскуючий шар2. дієсл. маскувати - artwork mask
- base-region mask
- base mask
- base-resistor mask
- bimetal mask
- blocking mask
- chrome mask
- collector mask
- composite mask
- contact-area mask
- contact mask
- contact-print additional mask
- custom mask
- deep UV mask
- delineation mask
- deposition mask
- diffusion mask
- doping mask
- dry film solder mask
- E-beam mask
- E-chrome mask
- electron-beam generated mask
- emitter mask
- emulsion mask
- etch ing mask
- etch mask
- etch-resistantmask
- etch-resistmask
- evaporation mask
- exposure mask
- fault injection mask
- faultless mask
- field-oxidemask
- fieldmask
- fine-line mask
- gold mask
- grid mask
- hard-surface mask
- high-contrast X-ray mask
- high-flatness mask
- high-transmission X-ray mask
- IC mask
- in situ mask
- insulator mask
- interconnection mask
- ion-beam stencil mask
- ion-implantation mask
- iron-oxide mask
- isolation mask
- layered mask
- lithographic mask
- master mask
- metal mask
- metal etched mask
- metallization etching mask
- metal-on-glass mask
- metal-on-polymer mask
- moving mask
- multi-pinhole mask
- native охide mask
- negative mask
- nonerodible mask
- offset mask
- optical mask
- optical gate mask
- overlaid mask
- oxidation mask
- oxygen-impermeable mask
- pattern mask
- pattern transfer mask
- photolithographic mask
- photoresist mask
- plating mask
- production mask
- programmingmask
- programmask
- projection mask
- p-well mask
- quartz mask
- refractory mask
- resistor-body mask
- reticle mask
- self-aligned mask
- sputter mask
- stencil mask
- step-and-repeat mask
- thick-film screen mask
- thin-film mask
- trench mask
- vacuum-deposition mask
- work mask
- X-ray lithography mask
- X-ray mask
- 1x mask
- 1:1 mask -
3 material
матеріал - acceptor material
- adulterated semiconductor material
- base material
- binding material
- brittle material
- bubble material
- carrier material
- cermet material
- coarse-featured resist material
- composite material
- compound semiconductor material
- conductivity-type imparting material
- contact material
- contrast enhancing material
- dopant masking material
- doped material
- doping material
- electronic material
- electron resist material
- encapsulating material
- encapsulation material
- epitaxial material
- etchant masking material
- etching material
- evaporated material
- evaporation material
- filler material
- film material
- fine-featured resist material
- foreign material
- fragile material
- group III-V compound semiconductor material
- heavily doped material
- high-resistivity material
- host material
- impurity material
- laminated material
- liquid-crystal material
- lowly doped material
- low-resistivity material
- LSCO material
- magnetostrictive material
- mask-forming material
- mask material
- mismatched materials
- molding material
- multilayer material
- negative-image material
- organosilicone material
- packaging material
- parent material
- patterned material
- photoresist material
- photoresponsive material
- photosensitive material
- piezoelectric material
- plastic material
- polycrystalline material
- positive-image material
- refractory material
- resist material
- resistive material
- semiconductive material
- semiconductor material
- semiconductor-glass composite material
- silicon-on-insulator material
- silicon-on-sapphire material
- Si-MBE material
- single-crystal material
- spinel material
- starting material
- stop-etch material
- substrate material
- superconducting material
- support material
- thallium-based material
- thixotropic material
- virgin material
- Y–Ba–Cu–O material
- Y1–Ba2–Cu3–O7-x material
- 1-2-3 material -
4 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process -
5 substrate
підкладка; основа - amorphous insulating substrate
- blank substrate
- bulk substrate
- composite substrate
- compound semiconductor substrate
- dislocation-free substrate
- foreign substrate
- garnet substrate
- glass-сеramic substrate
- glazed substrate
- high-resistivity substrate
- implanted substrate
- insulative substrate
- interconnection substrate
- ion-milled substrate
- low-resistivity substrate
- mask substrate
- MP substrate
- multilayer substrate
- multilayer printed substrate
- n-typesubstrate
- nsubstrate
- passive substrate
- porcelainized steel substrate
- porous polishing substrate
- preloaded substrate
- prescreened substrate
- pretinned substrate
- printed-wiring substrate
- p-type substrate
- silicon through-hole substrate
- SOI substrate
- SOS substrate
- stepless substrate
- thick-film multilevel substrate
- thick-film screened substrate
- thin-film substrate
- V-grooved silicon substrate
- V-grooved substrate
- wiring substrateEnglish-Ukrainian dictionary of microelectronics > substrate
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